System on Modules
System on Modules are the solution if you need a long product life-cycle and a flexible system. These modules are flexible in type of CPU (1-4 core), memory and I/O interfaces. The most modules work in a temperature range from -40 to +85 °C.
SOM vs COM
The difference between System on Modules (SOM) and Computer on Modules (COM) is that SOM use the newest CPUs and interfaces. Moreover you can operate a higher complex application than on a COM. The COMs include peripheral connectors, on a SOM most of the peripherals are integrated, i.e. WiFi or Bluetooth.
The DIGI International System on Modules are based on NXP/Freescale CPUs. The QUECTEL System on Modules are based on CPUs by Qualcomm.
Our suppliers in this category System on Modules:
DIGI INTERNATIONAL
Digi International was founded in 1985 and is headquartered in Minneapolis MN (USA). The Company is a publicly traded company on the NASDAQ stock Exchange. The company offers Embedded Modules & SBCs, RF-Modules and Wireless Design Services.
INTEL
High performance INTEL processors are at the heart of innovative solutions for service providers and broadcasters spanning the cloud, network, home gateway, clients, and mobile. The connected Home Division aims to transform people’s digital lives with trusted and effortless connected home experiences. As gateway technologies are transforming the home, INTEL targets to make the network faster and smarter. The broadband gateway is becoming the edge of the cloud and enabling the Internet of things and the smart, connected home.
QUECTEL
QUECTEL focuses on the wireless M2M market sector designing and manufacturing variety of wireless modules to fulfill different industrial standards and requirements.
THUNDERCOMM
THUNDERCOMM was founded in 2016 by ThunderSoft and Qualcomm. Based on Qualcomm's world-leading Snapdragon processors as well as ThunderSoft's powerful application and operating system technologies and service capability, THUNDERCOMM is dedicated to providing module and software solutions for IoT, AI, automatization, machine service, smart cameras, robotics, VR/AR devices, mobile devices, drones, and medical devices.
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